CVE-2023-33063

Qualcomm chipsets contain a remote use-after-free vulnerability actively exploited in the wild.

This use-after-free flaw in Qualcomm DSP Services allows remote memory corruption during HLOS-to-DSP calls, enabling attackers to bypass security controls on multiple chipsets. DIB orgs must verify firmware patching status and implement memory-safe DSP interfaces to prevent supply-chain compromise.

Shame score — Active exploitation of a remote memory corruption flaw in widely deployed hardware without immediate vendor mitigation.